Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences
In recent years tin-copper based solders with a variety of elemental additives have emerged which improve the overall properties and performance of tin-copper solders. These alternative SnCu based solders are not normally used in reflow soldering but are gaining use globally in wave and selective soldering operations.
This paper will describe how to achieve solder joint reliability using SnCu based solder with nickel and other additives such as bismuth.
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